Transition Capacitance and Diffusion Capacitance of Diode

Transition Capacitance CT of Diode (Space Charge Capacitance)

With the increase of the magnitude of reverse bias, majority carriers move away from the junction i.e. the width W of the depletion layer increases. This uncovered immobile charge on the two sides of the junction constitute a capacitor of incremental capacitance CT is given by,

C_T = |\dfrac{dQ}{dV}|               ……..(1)

Where dQ is the increase in the charge resulting from an increase dV in voltage.

Hence, a voltage change dV in the time interval dt will result in a current i was given by,

i = \dfrac{dQ}{dt} = C_T\dfrac{dV}{dt}               ………(2)

This capacitance CT is called the transition capacitance or space charge capacitance or barrier capacitance or depletion layer capacitance.

CT forms an important parameter of the junction. However, CT varies with the magnitude of the reverse bias. More the magnitude of the reverse bias greater is the width W of the depletion layer and smaller is the transition capacitance CT.

Forward biased pn diode

CT in a Step Graded Junction:

A junction is said to be step graded if there is an abrupt change from acceptor ion density on the P-side to donor ion density on the N-side. Such a junction gets formed in an alloyed junction (or Fused Junction) diode. In general, the acceptor density NA and the donor density ND are kept unequal. The transition capacitance CT is then given by,

C_T = \dfrac{\epsilon A}{W}           ……..(3)

Where \epsilon is an absolute permittivity of the semiconductor medium, A is the cross-sectional area of the junction and W is the of the depletion layer and is given by,

W^2 = [\dfrac{2\epsilon V_j}{q}][\dfrac{1}{N_A}+\dfrac{1}{N_D}]        ……..(4)

In case NA>>ND,

W = (\dfrac{2\epsilon V_j}{N_Dq})^{\dfrac{1}{2}}               ………..(5)

Hence, C_T = A(\dfrac{N_D}{V_j})^{\dfrac{1}{2}} \times (\dfrac{q\epsilon}{2})^{\dfrac{1}{2}}               ……….(6)

Thus, in a step graded junction, CT is inversely proportional to the square root of junction voltage Vj where Vj is given by,

V_j = V_o-V_d                ……….(7)

Where Vd is a negative number indicating the applied reverse bias and V0 is the contact potential.

CT in a Linear Graded Junction

A junction is said to be linear graded if there is a linear variation of net charge density with distance in the transition region. Such a junction gets formed in a frown junction diode.

In such a junction diode also, the transition capacitance is given by,

C_T = \dfrac{\epsilon A}{W}                  ………..(8)

Thus, the expression for CT for the linearly graded junction is the same as for step graded junction.

However, in this case, assuming NA = ND, the width W of the depletion layer is given by,

W = (\dfrac{6 \epsilon V_j}{q N_D})^{\dfrac{1}{2}}                ………(9)

Hence,

C_T = A(\dfrac{N_D}{V_j})^{\dfrac{1}{2}} \times (\dfrac{q\epsilon}{6})^{\dfrac{1}{2}}                  ……..(10)

Thus, in this case, also, CT is inversely proportional to the square root of Vj.

Diffusion Capacitance or Storage Capacitance CD

In the forward-biased diode, the potential barrier at the junction gets lowered. As a result, holes get injected from the P-side to the N-side and electrons get injected from the N-side to the P-side. These injected charges get stored near the junction just outside the depletion layer, holes in the N-region, and electrons in the P-region. Due to charge storage, the voltage lags behind the current producing the capacitance effect. Such a capacitance is called diffusion capacitance or storage capacitance CD.

The diffusion capacitance CD may be defined as the rate of change of injected charge with voltage,

Thus,

C_D = \dfrac{dQ}{dV}                 ………..(11)

But, in a forward biased diode with one region say P-region very heavily doped relative to the other region (N region), current (I) is mainly due to holes. Then (I) is given by,

 I = \dfrac{Q}{\tau_p}               …….(12)

Where Q is the stored charge and \tau_p is the mean lifetime of hole and is given by,

T_p = \dfrac{L_p^2}{D_p}                   ………….(13)

Where LP is the diffusion length for holes, and DP is the diffusion constant for holes.

Combining Equation (11) and (12), we get

C_D = \tau \dfrac{dI}{dV} = \dfrac{\tau}{r}                  ……….(14)

But from equation of dynamic resistance r \approx \dfrac{\eta V_T}{I}. Substituting this value of r in equation (14) we get,

C_D = \dfrac{\tau I}{\eta V_T}              ……….(15)

In a general case, diffusion constant CD is caused by the diffusion of both the holes in the n-regions and electrons in the P-region, resulting in diffusion capacitance CDp and CDn respectively. The total diffusion capacitance CD is the sum of CDp and CDn.

CD may have a value of a few thousand pF. This time constant CD. r mainly limits the frequency response of certain semiconductor devices when used in high-frequency applications.

In fact, in a forward diode, there are present both the diffusion capacitance CD and the transition capacitance CT, but CD>>CT. Typically, the CD is more than a million times greater than CT. Hence, in a forward-biased diode, CT may be neglected and we need to consider only CD.

Similarly, in reverse-biased diode, these are present both CD and CT. But CD<<CT. Hence, in a reverse-biased diode, we may neglect CD and we need to consider only CT.

For forward biased Ge diode (\eta = 1), at I = 13 mA, r = 2\Omega and then C_D = 0.5\tau. For  \tau = 20 \mu s, C_D = 10 \mu F.

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